View CL05CXXXX_933436.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

multilayer ceramic capacitor -highfrequency-
multilayer ceramic capacitor - high frequency - 1 - introduction mlcc for high frequency application is made of many layers of class i(c0g, etc) ceramic and cu inner electrodes like sandwich. class i(c0g, etc) ceramic has a small tcc(temperature coefficient of capacitance), a better frequen cy performance and a low esr(equivalent series resistance) value. therefore, it is used in rf applications such as cellular phone, tuner, and so on. feature and application feature -miniaturesize - wide capacitance and voltage range - highly reliable performance - tape & reel for surface mount assembly - low esr - high q at high frequencies - stable temperature dependence of capacitance application - high frequency module and high power circuit
multilayer ceramic capacitor - high frequency - 2 - structure
multilayer ceramic capacitor - high frequency - 3 - appearance and dimension l bw t w code eia code dimension ( mm ) l w t(max) bw 03 0201 0.6 0.03 0.3 0.03 0.3 0.03 0.15 0.05 05 0402 1.0 0.05 0.5 0.05 0.5 0.05 0.2+0.15/-0.1
multilayer ceramic capacitor - high frequency - 4 - previous part numbering symbol eia code temperature coefficient(ppm/ ) temperature characteristics operation temperature range c c0g(ch) 0 30 c -55 ~ +125 ? class (temperature compensating type) temperature characteristics below 2.0pf 2.2 ~ 3.9pf above 4.0pf above 10pf c c0g c0g c0g c0g p - p2j p2h p2h r - r2j r2h r2h s - s2j s2h s2h t - t2j t2h t2h u - u2j u2j u2j samsung multilayer ceramic capacitor type(size) capacitance temperature characteristics("c" only) nominal capacitance capacitance tolerance rated voltage code "g" : cu-inner electrode packaging type cl 10 c 101 j b g c temperature characteristics temperature characteristics ? k: 250 ppm/ j: 120 ppm/ h: 60 ppm/ g: 30 ppm/ 3 7 8 2 6 3 4 5 2 6 3 4 5 7 8 1 1
multilayer ceramic capacitor - high frequency - 5 - temperature characteristics symbol capacitance tolerance capacitance range capacitance step c0g(npo) or t.c series b 0.1pf 0.5~2.0pf 0.1pf 2.0~5.0pf e-24 step c 0.25pf <10pf e-24 step d 0.50pf f 1% 10pf e-24 step j 5% e-12 step please consult us for special tolerances. symbol rated voltage(vdc) a 25v b 50v rated voltage capacitance tolerance the nominal capacitance value is expressed in pico-farad(pf) and identified by three-digits. the first two digits represent significant figures and the last digit specifies the number of zeros to follow. for values below 1pf, the letter "r" is used as the decimal point. example) 100 : 10 10 o =10pf 102 : 10 10 2 = 1000pf 020 : 2 10 o =2pf 1r5 : 1.5pf nominal capacitance 5 6 4 type of inner electrode symbol description of the code g copper inner electrode-standard thickness 7
multilayer ceramic capacitor - high frequency - 6 - symbol packaging symbol packaging b bulk f embossed tape, 13" reel p cassette l paper 13" reel c paper tape, 7" reel o paper 10" reel d paper tape, 13" reel s embossed tape, 10" reel e embossed tape, 7" reel packaging type 8 series capacitance step e- 3 1.0 2.2 4.7 e- 6 1.0 1.5 2.2 3.3 4.7 6.8 e-12 1.0 1.2 1.5 1.8 2.2 2.7 3.3 3.9 4.7 5.6 6.8 8.2 e-24 1.0 1.2 1.5 1.8 2.2 2.7 3.3 3.9 4.7 5.6 6.8 8.2 1.1 1.3 1.6 2.0 2.4 3.0 3.6 4.3 5.1 6.2 7.5 9.1 standard capacitance is " each step 10 n " ? standard capacitance step
multilayer ceramic capacitor - high frequency - 7 - new part numbering cl10c101jb8gnnc 1 2 3 4 5 6 7 8 9 10 11 1 product abbreviation symbol product abbreviation cl samsung multilayer cer amic chip capacitor 2 size(mm) symbol size(mm) length width 03 0.6 0.3 05 1.0 0.5 samsung multilayer ceramic capacitor size(mm) capacitance temperature characteristic nominal capacitance capacitance tolerance rated voltage thickness option product & plating method samsung control code reserved for future use packaging type 7 8 2 6 3 4 5 1 9 10 11
multilayer ceramic capacitor - high frequency - 8 - 4 nominal capacitance nominal capacitance is identified by 3 digits. the first and second digits identify the first and second significant figures of the capacitance. the third digit identifies the multiplier. 'r' identifies a decimal point. example symbol nominal capacitance 1r5 1.5pf 103 10,000pf, 10nf, 0.01 f 104 100,000pf, 100nf, 0.1 f 5 capacitance tolerance symbol tolerance nominal capacitance b 0.1pf less than 10pf (including 10pf) c 0.25pf d 0.5pf f 1% more than 10pf j 5% symbol eia code temperature coefficient(ppm/ ) temperature characteristics operation temperature range c c0g(ch) 0 30 c -55 ~ +125 ? class (temperature compensating type) temperature characteristics below 2.0pf 2.2 ~ 3.9pf above 4.0pf above 10pf c c0g c0g c0g c0g p - p2j p2h p2h r - r2j r2h r2h s - s2j s2h s2h t - t2j t2h t2h u - u2j u2j u2j temperature characteristics temperature characteristics ? k: 250 ppm/ j: 120 ppm/ h: 60 ppm/ g: 30 ppm/ 3
multilayer ceramic capacitor - high frequency - 9 - 6 rated voltage symbol rated voltage symbol rated voltage a 25v b 50v 7 thickness option type symbol thickness(t) spec 0603 3 0.30 0.03 1005 5 0.50 0.05 8 product & plating method symbol electrode termination plating type a pd ag sn_100% n ni cu sn_100% g cu cu sn_100% 9 samsung control code symbol description of the code symbol description of the code a array (2-element) n normal b array (4-element) p automotive c high - q w 3 terminal emi filter l licc 10 reserved for future use symbol description of the code n reserved for future use
multilayer ceramic capacitor - high frequency - 10 - 11 packaging type symbol packaging type symbol packaging type b bulk f embossing 13" (10,000ea) p bulk case l paper 13" (15,000ea) c paper 7" o paper 10" d paper 13" (10,000ea) s embossing 10" e embossing 7"
multilayer ceramic capacitor - high frequency - 11 - description 0603 type (0201) 1005 type (0402) dimension(mm) l 0.6 0.03 1.0 0.05 w 0.3 0.03 0.5 0.05 t 0.3 0.03 0.5 0.05 max capacitance(pf) c 25v 20 - 50v - 10 ? capacitance vs chip thickness standard
multilayer ceramic capacitor - high frequency - 12 - packaging cardboard paper tape symbol w f e p1 p2 p0 d t a b type d i m e n s i o n 03 8.0 0.3 3.5 0.05 1.75 0.1 2.0 0.05 2.0 0.05 4.0 0.1 1.5 +0.1/-0 0.37 0.03 0.38 0.03 0.68 0.03 05 0.6 0.05 0.65 +0.05 -0.10 1.15 +0.05 -0.10 unit:mm a b feeding round holes perforated square holes for inserting a chip d p0 p1 p2 w f e t
multilayer ceramic capacitor - high frequency - 13 - taping size empty section 45 pitch packed part empty section 50 pitch loading section 35 pitch start end reel dimension e c d r a w b t symbol a b c d e w t r 7" reel 178 2.0 min. 50 13 0.5 21 0.8 2.0 0.5 10 1.5 0.8 0.2 1.0 13" reel 330 2.0 min. 70 unit:mm symbol cardboard paper tape 7" reel 10000 13" reel 10000 unit:pcs
multilayer ceramic capacitor - high frequency - 14 - size 03(0201) 05(0402) quantity n/a 50,000 bulk case packaging - bulk case packaging can reduce the stock space and transportation costs. - the bulk feeding system can increase the productivity. - it can eliminate the components loss. a bt c d e f w l g h i symbol a b t c d e dimension 6.8 0.1 8.8 0.1 12 0.1 1.5+0.1/-0 2+0/-0.1 4.7 0.1 symbol f w g h l i dimension 31.5+0.2/-0 36+0/-0.2 19 0.35 7 0.35 110 0.7 5 0.35 quantity * n/a : not adapted
multilayer ceramic capacitor - high frequency - 15 - characteristic map capacitance range ? class temperature characteristics size voltage capacitance range ( ? ) c(cog) 03 (0201) 25v 05 (0402) 50v 10 100 1000 10000 100000 1000000 10000000 100000000 0.5 20 10
multilayer ceramic capacitor - high frequency - 16 - reliability test data no item performance test condition 1 appearance no abnormal exterior appearance. through microscope( 10) 2 insulation resistance 10,000 ? or 500 ?? product whichever is smaller. (rated voltage is below 16v : 10,000 ? or 100 ?? ) rated voltage shall be applied. measurement time is 60 ~ 120sec rated voltage time 60 sec. 3 withstanding voltage no dielectric breakdown or mechanical breakdown. class : 300% of the rated voltage for 1~5sec, 4 capacitance class within the specified tolerance capacitance frequency voltage 1,000 ? and below 1 ? 10% 0.5 ~ 5 vrms more than 1,000 ? 1 ? 10% 5 q class over 30 ? :q 1,000 less than 30 ? :q 400 +20c ( c : capacitance ) capacitance frequency voltage 1,000 ? and below 1 ? 10% 0.5 ~ 5 vrms more than 1,000 ? 1 ? 10% 6 adhesive strength of termination no indication of peeling occur on the terminal electrode. a 500g.f pressure shall be applied for 10 1 second. 7 esr 2pf < c 5pf : below 200m ? 5pf < c 10pf : below 150m ? 10pf < c 33pf : below 100m ? test equipment : e4991b condition: frequency 1ghz, osc 100m at room temperature 500g.f
multilayer ceramic capacitor - high frequency - 17 - no item performance test condition 8 bending strength appearance no mechanical damage shall occur. bending shall be applied to the limit(1mm) with 0.3mm/sec. 20 bending 45 145 1limit capacitance character change of capacitance class i within 5% or 0.5pf whichever is larger 9 solderability more than 95% of the terminal surface is to be soldered newly, so metal part(a) does not come out or dissolve. in pb--free part, more than 95% of the terminal surface is to be soldered newly solder temperature : 230 5 dip time : 3 1sec solder : h63a flux : rma type *pb-free solder temperature : 260 5 solder : sn96.5-3ag-0.5cu flux : rma type diptime:3 0.1sec * pre-heating : at 80~120 for 10~30sec. 50 r=340 10 resistance to soldering heat appearance no mechanical damage shall occur. dip : solder temperature of 270 5 diptime:10 1 sec. each termination shall be fully immersed and preheated as following: measure at room temp. after cooling for class :24 2hours capacitance characteristic cap. change class within 2.5% or 0.25 ? whichever is larger q class 30 ? and over : q 1000 less than 30 ? :q 400+20 c insulation resistance to satisfy the specified initial value. withstanding voltage to satisfy the specified initial value. step temp.( ) time (sec.) 1 80~100 60 2 150~180 60
multilayer ceramic capacitor - high frequency - 18 - no item performance test condition 11 vibration test appearance no mechanical damage shall occur. the capacitor shall be subjected to a harmonic motion having a total amplitude of 1.5mm. the entire frequency range, from 10 to 55hz and return to 10hz, shall be traversed in 1 minute. this cycle shall be performed 2 hours in each there mutually perpendicular direction for total period of 6 hours. capacitance characteristi cap. change class within 2.5% or 0.25 ? whichever is larger class b within 5% f within 20% q class 30 ? and over : q 1000 less than 30 ? :q 400+20 c insulation resistance to satisfy the specified initial value. 12 humidity (steady state) appearance no mechanical damage shall occur. temperature : 40 2 relative humidity : 90~95 %rh test time : 500 +12/-0 hr. measure at room temperature after cooling for class :24 2hr. capacitance characteristi c capacitance change class within 5% or 0.5 ? whichever is larger q class 30 ? and over : q 350 10 ~30 ? :q 275 + 2.5 c less than 10pf : q 200 + 10 c insulation resistance minimum insulation resistance: 1,000 ? or 50 ?? product whichever is smaller. 13 moisture resistance appearance no mechanical damage shall occur. applied voltage : rated voltage temperature : 40 2 relative humidity:90~95%rh test time : 500 +12/-0 hr. current applied : 50 ? max. class should be measured initial value after be heat-treated for 1 hr in 150 +0/-10 and be left for 48 4hr at room temperature. class should be measured after left for 24 2 hrs in room temperature and humidity. class should be measured latter value after be heat-treated for 1 hr in 150 +0/-10 and be left for 48 4hr at room temperature. capacitance characteristi c capacitance change class within 7.5% or 0.75 ? whichever is larger q class 30 ? and over : q 200 30 ? and below : q 100 + 10/3 c insulation resistance minimum insulation resistance: 500 ? or 25 ?? product, whichever is smaller.
multilayer ceramic capacitor - high frequency - 19 - no item performance test condition 14 high temperature resistance appearance no mechanical damage shall occur. applied voltage : 200% of rated voltage test time : 1000 +48/-0 hr. current applied : 50 ? max. temp :125 3 class should be measured initial value after be heat-treated for 1 hr in 150 +0/-10 and be left for 48 4hr at room temperature. class should be measured after left for 24 2 hrs in room temperature and humidity. class should be measured latter value after be heat-treated for 1 hr in 150 +0/-10 and be left for 48 4hr at room temperature. capacitance characteris tic cap. change class within 3% or 0.3 ? , whichever is larger q class 30 ? and over : q 350 10 ~ 30 ? :q 275 + 2.5 c less than 10 ? :q 200 + 10 c insulation resistance minimum insulation resistance: 1,000 ? or 50 ?? product whichever is smaller. 15 temperature cycle appearance no mechanical damage shall occur. capacitors shall be subjected to five cycles of the temperature cycle as following step temp.( ) time (min) 1 min. rated temp. +0/-3 30 2 25 2~3 3 max. rated temp. +3/-0 30 4 25 2~3 measure at room temperature after cooling for class :24 2hr. class :48 4hr. capacitance characteristic cap. change class within 2.5% or 0.25 ? whichever is larger q class 30 ? and over : q 1000 less than 30 ? :q 400 +20 c insulation resistance to satisfy the specified initial value.
multilayer ceramic capacitor - high frequency - 20 - characteristic graph 0 50 100 1000 10000 0 10 -10 -20 -30 time(hr) c % c0g x7r y5v ? capacitance change - aging -60 140 0 -20 20 60 100 temperature( ) c % 0 5 -5 -10 10 c0g uj th rh sh ? impedance - frequency characteristics ? capacitance - dc voltage characteristics -100 -80 -60 -40 -20 0 20 40 0 5 10 15 20 25 30 35 40 dc v oltage(v dc) c0g 50v c % x7r 50v y5v 50v -60 120 0 -20 20 40 80 -80 -60 -40 -20 0 20 x7r y5v temperature( ) c % ? capacitance - temperature characteristics electrical characteristics 1 10 100 1000 ghz 1ghz 2ghz 3ghz impedance( ) 4 pf 7 pf 7.8pf
multilayer ceramic capacitor - high frequency - 21 - application manual storage condition ? storage environment the electrical characteristics of mlccs were degraded by the environment of high temperature or humidity. therefore, the mlccs shall be stored in the ambient temperature and the relative humidity of less than 40 and 70%, respectively. guaranteed storage period is within 6 months from the outgoing date of delivery. ? corrosive gases since the solderability of the end termination in mlcc was degraded by a chemical atmosphere such as chlorin, acid or sulfide gases , mlccs must be avoid from these gases. ? temperature fluctuations since dew condensation may occur by the differences in temperature when the mlccs are taken out of storage, it is important to maintai n the temperature-controlled environment. design of land pattern when designing printed circuit boards, the shape and size of the lands must allow for the proper amount of solder on the capacitor. the amount of solder at the end terminations has a direct effect on the crack. the crack in mlcc will be easily occurred by the tensile stress which was due to too much amount of solder. in contrast, i f too little solder is applied, the termination strength will be insufficiently. use the following illustrations as guidelines for proper land design. recommendation of land shape and size w b a solder land solder resist 2/3w < b < w t solder resist 2/3t < a < t adhesives when flow soldering the mlccs, apply the adhesive in accordance with the following conditions. ? requirements for adhesives they must have enough adhesion, so that, the chips will not fall off or move during the handling of the circuit board. they must maintain their adhesive strength when exposed to soldering temperature. they should not spread or run when applied to the circuit board. they should harden quickly. they should not corrode the circuit board or chip material.
multilayer ceramic capacitor - high frequency - 22 - they should be a good insulator. they should be non-toxic, and not produce harmful gases, nor be harmful when touched. ? application method it is important to use the proper amount of adhesive. too little and much adhesive will cause poor adhesion and overflow into the land, respectively. ? adhesive hardening characteristics to prevent oxidation of the terminations, the adhesive must harden at 160 or less, within 2 minutes or less. mounting ? mounting head pressure excessive pressure will cause crack to mlccs . the pressure of nozzle will be 300g maximum during mounting. ? bending stress when double-sided circuit boards are used, mlccs first are mounted and soldered onto one side of the board. when the mlccs are mounted onto the other side, it is important to support the board as shown in the illustration. if the circuit board is not supported, the crack occur to the ready-installed mlccs by the bending stress. support pin force nozzle flux although the solderability increased by the highly-activated flux, increase of activity in flux may also degrade the insulation of the chip capacitors. to avoid such degradation, it is recommended that a mildly activated rosin flux(less than 0.2% chlorine) be used.
multilayer ceramic capacitor - high frequency - 23 - soldering since a multilayer ceramic chip capacitor comes into direct contact with melted solder during soldering, it is exposed to potentially mechanical stress caused by the sudden temperature change. the capacitor may also be subject to silver migration, and to contamination by the flux. because of these factors, soldering technique is critical. ? soldering methods method classification reflow soldering - overall heating - infrared rays - hot plate - vps(vapor phase) - local heating - air heater -laser - light beam flow soldering - single wave - double wave - * we recommend the reflow soldering method. ? soldering profile to avoid crack problem by sudden temperature change, follow the temperature profile in the adjacent graph. 300 250 200 150 100 50 preheating soldering cooling 60~120sec 10~20sec reflow soldering 300 250 200 150 100 50 preheating soldering cooling t 150 60~120sec 3~4sec flow soldering ? manual soldering manual soldering can pose a great risk of creating thermal cracks in chip capacitors. the hot soldering iron tip comes into direct contact with t he end terminations, and operator's carelessness may cause the tip of the soldering iron to come into direct contact with the ceramic body of the capacitor. therefore the soldering iron must be handled carefully, and close attention must be paid to the selection of the soldering iron tip and to temperature control of the tip.
multilayer ceramic capacitor - high frequency - 24 - ? amount of solder too much solder not enough solder cracks tend to occur due to large stress weak holding force may cause bad connections or detaching of the capacitor good ? cooling natural cooling using air is recommended. if the chips are dipped into solvent for cleaning, the temperature difference( t) must be less than 100 6-6. cleaning if rosin flux is used, cleaning usually is unnecessary. when strongly activated flux is used, chlorine in the flux may dissolve into some type s of cleaning fluids, th ereby affecting the chip capacitors. this means that the cleaning fluid must be carefully selected, and should always be new. ? notes for separating multiple, shared pc boards. a multi-pc board is separated into many individual circuit boards after soldering has been completed. if the board is bent or distorted at the time of separation, cracks may occur in the chip capacitors. carefully choose a separation method that minimizes the bending of the circuit board.
multilayer ceramic capacitor - high frequency - 25 - cross reference p/n company samsung avx johanson kemet kyocera murata novacap panasonic rohm taiyo - yuden tdk vitramon company model(mlcc) cl - - c cm grm - ecj mch mk c vj size (eia/jis) 0201(0603) 03 - - - 03 33 - z - 063 0603 - 0402(1005) 05 0402 r07 0402 05 36 0402 0 15 105 1005 0402 0603(1608) 10 0603 r14 0603 105 39 0603 1 18 107 1608 0603 0805(2012) 21 0805 r15 0805 21 40 0805 2 21 212 2012 0805 1206(3216) 31 1206 r18 1206 316 42-6 1206 3 31 316 3216 1206 1210(3225) 32 1210 s41 1210 32 42-2 1210 4 32 325 3225 1210 1808(4520) 42 1808 r29 1808 42 - 1808 - - - 4520 1808 1812(4532) 43 1812 s43 1812 43 43-2 1812 - 43 432 4532 1812 2220(5750) 55 - - 2220 55 44-1 2221 - - 550 5650 - temperature characteristic cog(npo) c a n g cg cog/ch n c a c cog/ch a p2h(n150) p s - - p p2h - p - p ph - r2h(n220) r 1 - - r r2h - r - r rh - s2h(n330) s 3 - - s s2h - s - s sh - t2h(n470) t o - - t t2h - t - t th - u2j(n750) u z - - u u2j - u uj u uj - s2l l y - - sl sl - g sl sl sl - x7r b c w r(x) x7r x7r b b c bj x7r(b) y(x) z5u e e z u - z5u z - e - z5u u y5v f g y v y5v y5v y f f f y5v - nominal capacitance ex) 103=10,000 ? 221=220 ? 225=2,200,000 ? =2.2 ? 1r5=1.5 ? 010=1 ? capacitance tolerance b: 0.1 ? c: 0.25 ? d: 0.5 ? f: 1% g: 2% j: 5% k: 10% m: 20% z:-20~+80% rated voltage 6.3v q 6 - 9 06 6.3 - 0j - j 0j - 10 v p z 100 8 10 10 - 1a 4 l 1a - 16 v o y 160 4 16 16 160 1c 3 e 1c j 25 v a 3 250 3 25 25 250 1e 2 t 1e x 50 v b 5 500 5 50 50 500 1h 5 u 1h a 100 v c 1 101 1 100 100 101 2a 1 - 2a b 200v d 2 201 2 200 200 201 2d - - - c 250v e v - - 250 250 251 - - - 2e - 500v g 7 501 - 500 500 501 - - - - e 630v h - - - 630 630 - - - - 2j - 1000v i a 102 - 1000 1k 102 - - - 3a g 2000v j g 202 - 2000 2k 202 - - - 3d - 3000v k h 302 - 3000 3k 302 - - - 3f h 4000v - j - 4000 - 402 - - - - - termination nickel barrier n t v c a (grm) n - (mch) - - x ag/pd p 1 - - b (gr) p - (mc) - - f package bulk(vinyl) b 9 (none) - b pb * x - b b b paper taping c 2, 4 t, r - t, l pt t e,v,w k, l t t c, p plastic taping e 1, 3 e, u - h, n pt - f, y p, q t - t, r bulk case p 7 - - c pc - c c - - g
multilayer ceramic capacitor - high frequency - 26 - ? samsung : cl10b104ka8nnnc cl 10 b 104 k a 8 n n n c ? avx : 06033c104kat2a 0603 3 c 104 k a t 2 a ? johanson : 250r14w104kv6t 250 r14 w 104 k v 6 t ? kemet : c0603c104k3rac c0603c 104k 3r a c series size 03 = 0201 05 = 0402 10 = 0603 21 = 0805 31 = 1206 32 = 1210 43 = 1812 55 = 2220 dielectric c=c0g p=p2h r=r2h s=s2h t=t2h u=u2h l=s2l b=x7r a=x5r f=y5v capacitance 2 significant figures + number of zeros use "r" for decimal point tolerance a= 0.05pf b= 0.1pf c= 0.25pf d= 0.5pf f= 1% g= 2% j= 5% k= 10% m= 20% z = +80,-20% voltage q = 6.3v p=10v o=16v a=25v b=50v c = 100v d = 200v e=250v g = 500v h = 630v i = 1000v thickness 3 = 0.30 5 = 0.50 8 = 0.80 a=0.65 c = 0.85 h = 1.60 i=2.00 j = 2.50 l = 3.20 electrode/ termination/ plating a=pd/ag/ sn 100% n=ni/cu/ sn 100% g=cu/cu/ sn 100% products a=array (2-element) b=array (4-element) c=high-q l=licc n = normal p=automotive w = 3 terminal chip special various packaging b=bulk p = cassette c=paper7" d=paper13" (10,000ea) e = embossing 7" f = embossing 13" l = paper 13" (15,000ea) o=paper10" s = embossing 10" size 0201 0402 0603 0805 1206 1210 1812 2220 2225 voltage 4=4v 6 = 6.3v z=10v y = 16v 3=25v b=50v c = 100v d = 200v e = 250v g = 500v i = 1000v dielectric a=c0g c=x7r d=x5r e=z5u g=y5v capacitance 2 significant figures + number of zeros use "r" for decimal point tolerance b= 0.1pf c= 0.25pf d= 0.5pf f= 1% g= 2% j= 5% k= 10% m= 20% z = +80, -20% p = gmv,+100,-0% failure rate a=n/a termination t = sn 100% 7=goldplated 1=pd/ag packaging 2 = 7" reel 4 = 13" reel 7 = cassette 9=bulk special a = standard t = 0.66mm s = 0.56mm r = 0.46mm voltage 2 significant figures + number of zeros size r07 = 0402 r14 = 0603 r15 = 0805 r18 = 1206 s41 = 1210 s43 = 1812 s47 = 2220 s48 = 2225 s49 = 1825 s54 = 3640 dielectric n=c0g w=x7r x=x5r z=z5u y=y5v capacitance 2 significant figures + number of zeros use "r" for decimal point termination v = ni barrier marking 4=nomark 6 = marking packaging e = 7" reel plastic t = 7" reel paper r = 13" reel paper u = 13" reel plastic none = bulk series size 0402 0603 0805 1206 1210 1812 2220 2225 specification c = standard a=gr900 p = mil-c-55681 cdr01-cdr06 n = mil-c-55681 cdr31-cdr35 z = mil-c-123 e=milequivalent (group a only) capacitance 2 significant figures + number of zeros use "r" for decimal point tolerance b= 0.1pf c= 0.25pf d= 0.5pf f= 1% g= 2% j= 5% k= 10% m= 20% z=+80,-20% p = +100, 0% voltage 9=6.3v 8=10v 4=16v 3=25v 5=50v 1=100v 2=200v dielectric g=c0g r=x7r p=x5r u=z5u x = bx(mil) v=y5v tolerance b= 0.1pf c= 0.25pf d= 0.5pf f= 1% g= 2% j= 5% k= 10% m= 20% z = +80, -20% p = gmv,+100,-0% failure rate a=standard m=1.0(mil) p = 0.1 (mil) r=0.01(mil) s=0.001(mil) termination c=niw/tinplate h = ni w/solder t=silver g=goldplated
multilayer ceramic capacitor - high frequency - 27 - ? kyocera : cm105x7r104k25at cm 105 x7r 104 k 25 a t ? murata : grm188r71e104ka01d grm 18 8 r7 1e 104 k a01 d ? novacap : 0603b104k250n_tm 1206 b 104 k 250 n - t m ? panasonic : ecj1eb1e104k ecj 1 e b 1e 104 k series size 03 = 0201 05 = 0402 105 = 0603 21 = 0805 316 = 1206 32 = 1210 42 = 1808 43 = 1812 55 = 2220 dielectric cg x8r x7r x5r z5u y5v y5u capacitance 2 significant figures + number of zeros use "r" for decimal point tolerance b= 0.1pf c= 0.25pf d= 0.5pf f= 1% g= 2% j= 5% k= 10% m= 20% z = +80, -20% p=+100,0% voltage 04 = 4v 06 = 6.3v 10 = 10v 16 = 16v 25 = 25v 50 = 50v 100 = 100v 250 = 250v 500 = 500v 1000 = 1000v termination a = ni barrier packaging t = 7" reel (4mm pitch) l = 13" reel (4mm pitch) h = 7" reel (2mm pitch) n = 13" reel (2mm pitch) b=bulk(vinylbags) c = bulk cassette series ni barrier size 03 = 0201 15 = 0402 18 = 0603 21 = 0805 31 = 1206 32 = 1210 42 = 1808 43 = 1812 55 = 2220 thickness 3=0.3mm 5=0.5mm 8=0.8mm a=1.0mm b = 1.25mm c = 1.6mm d = 2.0mm e=2.5mm f = 3.2mm dielectric 5c = c0g r7 = x7r r6 = x5r e4 = z5u f5 = y5v voltage 0j = 6.3v 1a = 10v 1c = 16v 1e = 25v 1h = 50v 2a = 100v 2e = 250v 2h = 500v 3a = 1000v capacitance 2 significant figures + number of zeros use "r" for decimal point tolerance b= 0.1pf c= 0.25pf d= 0.5pf f= 1% g= 2% j= 5% k= 10% m= 20% z = +80,-20% p=+100,0% individual specification code packaging d = 7" reel paper l = 7" reel plastic j = 13" reel paper k = 13" reel plastic b=bulk c = bulk cassette t=bulktray size 0402 0603 0805 1005 1206 1210 1808 1812 2220 dielectric n=c0g b=x7r x=bx z=z5u y=y5v capacitance 2 significant figures + number of zeros use "r" for decimal point tolerance b= 0.1pf c= 0.25pf d= 0.5pf f= 1% g= 2% j= 5% k= 10% m= 20% z = +80,-20% p = +100, 0% voltage 2 significant figures + number of zeros termination p=pd/ag n=nibarrier (sn 100%) y = ni barrier (sn/pb) thickness per specified packaging t = reel none = bulk w=wafflepack marking series size z = 0201 0 = 0402 1 = 0603 2 = 0805 3 = 1206 4 = 1210 packaging x=bulk e = paper 2mm v = paper 4mm f, y = plastic 4mm w = large reels 2mm z = large reels 4mm c = bulk cassette dielectric c=c0g b = x7r, x5r f=y5v voltage 0j = 6.3v 1a = 10v 1c = 16v 1e = 25v 1h = 50v 2a = 100v 2d = 200v tolerance c= 0.25pf d= 0.5pf f= 1% j= 5% k= 10% m= 20% z = +80, -20% capacitance 2 significant figures + number of zeros use "r" for decimal point
multilayer ceramic capacitor - high frequency - 28 - ? rohm : mch182c104kkn mch 18 2 c 104 k k n ? taiyo-yuden : tmk107bj104k_t tm k 107bj104 k -t ? tdk : c1608x7r1e104kt c 1608 x7r 1e 104 k t ? vitramon : vj0603y104kxxmc vj 0603 y 104 k x x m c series size 15 = 0402 18 = 0603 21 = 0805 31 = 1206 32 = 1210 43 = 1812 voltag e 4 = 10v 3 = 16v 2 = 25v 5 = 50v dielectric a=c0g c=x7r f=y5v capacitance 2 significant figures + number of zeros use "r" for decimal point tolerance b= 0.1pf c= 0.25pf d= 0.5pf f= 1% g= 2% j= 5% k= 10% m= 20% z = +80,-20% p = +100, 0% packaging k = 7" reel paper p=7"reelplastic l = 13" reel paper q = 13" reel plastic b=bulk c = bulk cassette marking/thickness n=marked special thickness voltage a=4v j = 6.3v l=10v e=16v t=25v u = 50v type m = multilayer v=hiq termination k = ni barrier size 105 = 0402 107 = 0603 212 = 0805 316 = 1206 325 = 1210 432 = 1812 550 = 2220 dielectric cg = c0g ch = c0h cj = c0j ck = c0k bj = x5r, x7r f=y5v capacitance 2 significant figures + number of zeros use "r" for decimal point tolerance c= 0.25pf d= 0.5pf f= 1% g= 2% j= 5% k= 10% m= 20% z = +80,-20% special various packaging t = reel b=bulk series size 0603 = 0201 1005 = 0402 1608 = 0603 2012 = 0805 3216 = 1206 3225 = 1210 4532 = 1812 5650 = 2220 dielectric cg x7r z5u y5v voltage 0j = 6.3v 1a = 10v 1c = 16v 1e = 25v 1h = 50v capacitance 2 significant figures + number of zeros use "r" for decimal point tolerance c= 0.25pf d= 0.5pf f= 1% g= 2% j= 5% k= 10% m= 20% z = +80, -20% packaging t=reel b=bulk series size 0402 0603 0805 1206 1210 1812 2225 dielectric x=bx a,n = c0g y=x7r u=z5u h=x8r capacitance 2 significant figures + number of zeros use "r" for decimal point tolerance b= 0.1pf c= 0.25pf d= 0.5pf f= 1% g= 2% j= 5% k= 10% m= 20% z = +80, -20% p=+100,0% termination x=silver, ni barrier tin plated voltage j=16v x=25v a=50v b=100v c = 200v marking m = marking a = no marking packaging c = 7" reel paper t = 7" reel plastic p = 13" reel paper r = 13" reel plastic b=bulk

▲Up To Search▲

Price & Availability of CL05CXXXX

	To Download CL05CXXXX Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .